San Diego, Calif. — SMK's new lead-free socket accepts Standard Mobile Imaging Architecture (SMIA) specifications for the 9.5 x 9.5 mm camera module known as SMIA95. The new device is suitable for ...
Offered in low-profile and very-low-profile SMT and press-fit aerodynamic options, the DDR3 socket maximizes air flow around memory modules during operation. Engineered with a 2.40mm seating plane, ...
Diamond Systems a supplier of ruggedised single board computers (SBCs) and I/O expansion modules has unveiled an adapter board that allows the use of FeaturePak I/O expansion modules in systems that ...
Molex Incorporated has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback