For folk who aren't familiar, AMD's desktop CPUs since third-generation Ryzen have followed a particular form: two or three chips under an integrated heatspreader, with one being an I/O die that ...

AMD has been unable to grow revenues as Nvidia dominates the data center segment for AI accelerators. AMD and Nvidia hardware have a few key differences and overall Nvidia simply provides better ...

LONDON & TORONTO--(BUSINESS WIRE)--Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has collaborated with Arm on the ...

Mass production of the GPU component has reportedly been delayed to the end of 2023, making a launch unlikely until 2024. When you purchase through links on our site, we may earn an affiliate ...

Ever since the first rumors started swirling about AMD using a chiplet-based design for its GPUs (just as it had done for its Ryzen processors), knowledgeable folks expressed concern about exactly ...

Intel Corp. has shared new technical details about Meteor Lake, an upcoming series of desktop and laptop processors that will feature chiplet technology. Intel detailed the processor series today ...

Socionext has announced a partnership with Arm and TSMC to develop an innovative, power-optimized 32-core CPU chiplet in TSMC's 2nm silicon technology, enabling scalable performance for hyperscale ...

What’s Arm up to in design and development of chiplets, the highly integrated large-scale silicon solutions? The IP giant is gradually unveiling its design blueprint for one of the most exciting ...

“Waferscale processor systems can provide the large number of cores, and memory bandwidth required by today’s highly parallel workloads. One approach to building waferscale systems is to use a chiplet ...

Some of the CPU industry’s heaviest hitters—including Intel, AMD, Qualcomm, Arm, TSMC, and Samsung—are banding together to define a new standard for chiplet-based processor designs. Dubbed Universal ...

The world’s biggest chipmakers are coming together to create a new Universal Chiplet Interconnect Express (UCIe) system for integrating chiplets together in future semiconductor designs. Virtually ...