A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties.

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Custom-designed, photochemically etched surface-mount and insert-mount lead frames for integrated circuit manufacturing are now available. The frame’s base materials include Kovar, nickel-iron alloys, ...

The growing demand for power semiconductors, which control large currents and voltages, has resulted in their widespread use in various electronic devices, including electric vehicles (EVs). The ...

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at ...